Die bonders, Pick and Place systems MAT6200, MAT6500
价格:
征求报价
MAT (Micro Assembly Technology) manufactures manual, semi-automatic, and fully automatic die bonder systems for various applications.
Share Product:
资料
The company's systems are capable of eutectic, epoxy, flip chip, and wet stacked die bonding. They offer different heating methods and presentation options for die and components.
规格
| 关键词 | |
| 品牌 | |
| 来源 | IL |