Underfill, Corner and Edge Bonding
https://www.adherasg.com/encapsulant-underfill-potting-adhesives
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Underfill and cornerbond encapsulants are epoxy-based materials designed to protect electronic components like BGA, CSP, and Flip Chips from mechanical and thermal stress. Underfills fill the gap between the component and the circuit board, providing protection against shock, drop, vibration, and thermal cycling. Cornerbonds and edgebonds offer targeted adhesive solutions for specific areas, enhancing the overall durability of the assembly.
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Key Properties
Formulation: 1-component epoxy-based underfill, B-stage underfill
Applying Methods: Dispensing and jetting
Curing:
- Thermal curing as fast as 3 mins at 150°C
- Low temperature curing at 80°C for 120 mins
- B-stage underfills tacked at 90°C for 2 hours and fully cured at 150°C for 3 hours
Work Life: Ranges from 12 hours to more than a week, which allows for flexibility in production processes.
Glass Transition Temperature (Tg): Up to 250°C
Coefficient of Thermal Expansion (CTE): As low as 14 ppm/K
Application-Specific Options:
- Zero-gap underfills with excellent capillary flow are available for solder bump standoffs as small as 5µm.
- High-temperature-resistant underfills with Tg of up to 250°C.
- B-stage underfills are available.
- Highly thermally conductive underfills with thermal conductivity of 0.9 W/m·K.
- Certain materials can be co-cured during a solder reflow process.
- Low-outgassing products meeting NASA emission standards.