Encapsulation, Glob Top, Dam and Fill
https://www.adherasg.com/encapsulant-underfill-potting-adhesives
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Glob Top and Dam & Fill encapsulants are a type of material used to protect sensitive electronic components from harsh environments. These epoxy-based resins provide reliable protection for bare silicon dies, crystal oscillators, and other components in micro-electronic assemblies. They are an effective solution in demanding applications that require resistance to thermal cycling and humidity.
Glob Top encapsulants are typically used for smaller chips, while Dam & Fill encapsulants are used for larger dies. Dam & Fill materials are also optimised for a co-cure process to minimise production time.
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Key Properties
Formulation: 1-component epoxy-based adhesives
Applying Methods: Dispensing and jetting
Curing:
- Thermal curing 150°C for 2 hours or 165°C for 1 hour
- UV-A Curing 120 mW/cm² for 30 seconds for a 500µm thick layer
Work Life: Ranges from 60 minutes to 48 hours, which allows for flexibility in production processes.
Glass Transition Temperature (Tg): Up to 250°C
Coefficient of Thermal Expansion (CTE): As low as 18 ppm/K
Application-Specific Options:
- UV curing options available for applications on temperature-sensitive substrates where a quick, low-heat curing process is required.
- Soft formulations ideal for use with flexible substrates.