Wafer Tape UV Curing System
https://www.adherasg.com/wafer-tape-curing
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R.F.Q
Our advanced UV Wafer Tape Curing System delivers uniform, high-intensity UV light to effectively cure UV-sensitive adhesive tapes on wafers, a critical step that significantly reduces the tape's adhesion. This process is essential for achieving a clean and damage-free tape release, which is crucial for subsequent back-end processes like die bonding. With its intuitive touch-screen interface, you can precisely manage power and duration to optimise your curing process. The system's flexible design is compatible with a wide range of wafer sizes and is easily adaptable to your specific production needs. Equipped with a comprehensive suite of safety features and a long-life LED light source, this system ensures consistent results, maximum productivity, and a safe working environment for your operators.
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Technical Specifications
LED Wavelength: 365nm, other wavelengths upon request
Light Intensity: Up to 400 mW/cm²
Power: Adjustable power settings from 10% to 100%
Timer: Countdown timer settings from 0.1s to 999.9s
Wafer loading and unloading: Manual
Wafer Size Compatibility: 4”, 6”, 8”, 10” and 12” interchangeable
Operating Life: > 20,000 hours under normal operating conditions
Controls: Integrated intuitive touch-screen controls or a separate LED controller unit
Safety Features: Complete UV-blocking enclosure, chamber door safety cut-off, traffic light beacon with alarm (optional), emergency stop switch (optional)
Operation Modes:
- Continuous run at constant power setting
- Timer mode at constant power setting
- Multi-steps profile, up to 20 steps in 1 cycle
Options: Inert (Nitrogen) gas environment