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Surface Mount Devices (SMD)

Surface Mount Devices (SMD)

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R.F.Q

Our advanced surface mount adhesives (SMA) are engineered to meet the demands of high-speed electronics assembly. These adhesives are optimised for a range of application methods, including high-speed dispensing, jetting, and printing. All our SMA products are compatible with Pb-free wave soldering processes and provide exceptional green strength, ensuring components remain securely in place during the critical pick-and-place stage and subsequent thermal cycling. We offer a comprehensive portfolio tailored to specific manufacturing needs, including fast-curing formulations for high-throughput lines and options with varying viscosities to suit different equipment and processes.

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Key Properties

Formulation: 1- and 2-component adhesives

Applying Methods: Dispensing, jetting, stencil printing

Curing: As fast as 10 seconds at 170°C

Work Life: Work life ranges from 5 to 10 days.

Application-Specific Options:

  • Low Exothermic Energy: Minimises heat generated during the curing process, protecting sensitive components from thermal stress.
  • Colour: Available in a range of colors, including Yellow, Black, and Red, for process control and compatibility with automated optical inspection (AOI) systems.
  • Low-Temperature Curing: Cures at temperatures as low as 80°C, providing a fast cure for high-speed production lines.
  • Viscosity: A variety of viscosity and thixotropic index options are available for different application methods.