Die bonders, Pick and Place systems MAT6200, MAT6500
価格:
R.F.Q
MAT (Micro Assembly Technology) manufactures manual, semi-automatic, and fully automatic die bonder systems for various applications.
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詳細
The company's systems are capable of eutectic, epoxy, flip chip, and wet stacked die bonding. They offer different heating methods and presentation options for die and components.
仕様書
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| 起源 | IL |