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Vacuum Reflow Soldering Systems

Vacuum Reflow Soldering Systems

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Invacu specializes in vacuum reflow soldering systems that provide void-free solder joints for power electronics and other semiconductor devices.

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These systems use a vacuum to remove voids during the reflow process. They are also capable of using formic acid for flux-less soldering applications, making them suitable for various precision and sensitive soldering tasks.

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