Sintering Materials
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Sintering materials, which include thermoset hybrid-sintering epoxy based adhesives and silver-based pastes, are used for high-power die attach applications. These materials are valued for their combination of high temperature resistance and best-in-class thermal and electrical conductivity. They are well-suited for applications such as power semiconductors, LEDs, automotive EV power modules, and RF devices. Despite their high filler loading, these materials have a relatively low viscosity, which makes them well-suited for easy application like dispensing and stamping.
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Key Properties
Formulation: Silver and copper sintering pastes, and hybrid-sintering epoxy based adhesives.
Applying Methods: Dispensing, stamping, stencil printing
Sintering Methods:
- Pressure-assisted: Drying at 200°C for 10 mins and sintering at 250°C for 5 mins
- Pressure-less: 200°C for 1 hour
- Hybrid-sintering epoxy based adhesives: 120°C for 15 mins and ramp up to 200°C in 15 mins
Volume Resistivity:
- Sintering Pastes: As low as 4 x 10-6 Ohm.cm
- Hybrid-sintering epoxy based adhesives: As low as 3.8 x 10-6 Ohm.cm
Thermal Conductivity:
- Sintering Pastes: >200 W/m.K
- Hybrid-sintering epoxy based adhesives: >60 W/m.K
Work Life: Up to 24 hours
Application-Specific Options:
- Variety of viscosity for different application methods.
- Choice of silver or copper-based materials.
- Versions with improved electrical conductivity.
- Options specifically designed for high-speed, fine dot dispensing.