Die Attach Adhesives
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R.F.Q.
Our advanced die attach adhesives are engineered to meet the rigorous demands of modern electronics manufacturing. Optimised for high-speed dispensing and jetting, these adhesives ensure maximum efficiency on the production line. We offer a versatile range of solutions, including electrically conductive adhesives for superior electrical and thermal performance, and insulating adhesives that provide robust mechanical support while ensuring electrical isolation. Key properties such as rapid curing, ideal viscosity, and exceptional thermal management capabilities—including high glass transition temperature (Tg) and thermal conductivity—are all carefully balanced to deliver a reliable, high-performance bond for any application.
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Key Properties
Formulation: 1- and 2-component adhesives, B-stage curing formulation
Applying Methods: Dispensing, jetting, stencil printing, screen printing
Curing:
- 1-component: As fast as 1 min at elevated temperatures > 150°C
- 2-component: 24 hours at room temperature or faster at elevated temperatures
- B-stage curing: 90°C for 2 hours followed by 150°C for 3 hours
Volume Resistivity: Typically less than 5×10−4 Ohm-cm, ensuring efficient electrical conductivity.
Work Life: Our adhesives offer a work life that ranges from 45 minutes to 5 days, accommodating various production line speeds and processes.
Application-Specific Options:
Low-Temperature Cure:
- 80°C for 1-component material
- Room temperature for 2-component
- High temperature performance: Options with high Tg of 250°C for up to 300°C high temperature resistance.
- Low outgassing: Meeting strict NASA or ESA outgassing standards
- Flexibility: To overcome coefficient of thermal expansion (CTE) mismatch
- Variety of viscosity and thixotropic index for different application methods.
- Process Versatility: B-stage curing options for a more flexible assembly process.
- Flammability Safety & Compliance: UL94-V0 certified die attach adhesives.